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[Sintering Material Compatible] Vacuum and Reduction Sintering Furnace <Maximum 615×615mm>

Large substrate-compatible vacuum and reducing atmosphere sintering furnace │ Capable of multi-purpose processing such as soldering, sintering bonding, and Cu via firing.

A large substrate-compatible model has been introduced for our vacuum reflow device, which boasts the industry's No. 1 track record! It can be utilized not only for conventional soldering but also for sintering bonding, via firing, and other multipurpose processing. For sintered material compatibility, gas introduction is possible without initial vacuum evacuation. It supports sizes up to 615×615mm while achieving the same temperature distribution performance within the substrate as previous models. We also accommodate various customizations. Please feel free to contact us.